PACK & GIFT 2017:

CURRENT TECHNOLOGICAL SOLUTIONS OPEN A NEW FIELD TO CREATIVITY.

PACKPLEK will be present in the 10th edition of PACK & GIFT 2017, which is held June 21 and 22 in Paris, Hall 5.2 Porte de Versailles.

Our product lines will be presented with a selection of exclusive boxes and cases, which you will surely love, in STAND B2Bis WWW.PACKPLEK.COM.

This 10th edition of Pack & Gift attempts to highlight the enormous potential that opens up a new creative field: packaging, accessories, personalized connected solutions, unitary printing techniques or signature designer… It represents a unique opportunity to discover the current conference program, together with its educational exhibitions and contests, for the best personalized solution.

The fair has more than 150 exhibitors, conferences, workshops presentations among many other activities related to the sector.

PACKPLEK attends the fair, which has an enormous relevance in the French market. We are introduced as a company that offers multiple creative options in personalized packaging, both in wood and cardboard.